A laser beam and CCD are used to measure the printed board warpage.
Together with a loader and rejecter, labor coast can be reduced dramatically.
FEATURES
◎DIGITAL PANEL METER
Easy operation with the digital panel meter attached on the control box. Data/conditions also can be preset and indicated with the digital panel meter.
◎HIGH SPEED
The printed board is carried/measured on the conveyor at a max.15m/min high speed.(19/15m/min 60/50HZ)
◎WIDE AND STABLE LASER RANGE
Laser irradiation range is max.25mm, so measurement is stable.
◎CONNECTION TO PC AND PRINTER
A PC and a printer can be connected for data collecting and printing. (Option)
◎SEMICONDUCTOR LASER LOADED
Comparing to the He-Ne gas laser, laser is smaller, light-weighted and easy adjustment.
SPECIFICATIONS
Board size: min75(W)mm×75(L)mm~max400(W)mm×400(L)mm
Board thickness: 0.1~5.0mm
Measurable board warp:0.1~7.0mm
Board loading interval:100mm or more
Measuring accuracy: ±0.05mm
Light source:Semiconductor laser
Light receive element:CCD 5000 bit
Motor: 100W(Belt CV)、100W(Vacuum)
Power: 3 phases、200V、1KVA

 

 

Copyright 2007 FUJI MACHINERY All Rights Reserved
Web Design By SAYHO