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Laminating with vacuum, high pressure and heating
Full automatic operation after you put works on the start-station.
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FEATURES
◎NEW
FORM LAMINATER
Minute space between a printed circuit board and insulating
adhesive is reduced, and insulating adhesive is melted
and impregnated, and adhesive is hardened by increasing
pressure inside a chamber.
◎AUTOMATIC
FEEDING BY CARRYIER FILM
With putting carrier film under boards, the work until
the final process from start station is full automatic
operation.
SPECIFICATIONS
Machine size：5358(L)mm×1180(W)mm×max.1800(h)mm
Board size： min.□75mm～max.510(W)mm×610(L)mm
Board thickness： 0.05～3.0mm
Temperature：Room temp.～180℃（set
up 1℃ unit）
Vacuum：Less than 1hpa（Reduced
time within 15sec ）
Forming pressure：1Mpa（set
up 0.1Mpa unit）
（max. 30ton/510mm×610mm）
Carriage mechanism：Carrier
film which put boards is
reeled with two rolls of the exit.
（Automatic reeling）
Carriage speed：1m/min～18m/min
Variable speed（soft start）
Cooling：Radiate heat stage
100℃→Normal temperature
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