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Laminating with vacuum, high pressure and heating
Full automatic operation after you put works on the start-station.
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FEATURES
?/strong>NEW
FORM LAMINATER
Minute space between a printed circuit board and insulating
adhesive is reduced, and insulating adhesive is melted
and impregnated, and adhesive is hardened by increasing
pressure inside a chamber.
?/strong>AUTOMATIC
FEEDING BY CARRYIER FILM
With putting carrier film under boards, the work until
the final process from start station is full automatic
operation.
SPECIFICATIONS
Machine size?/font>5358(L)mm×1180(W)mm×max.1800(h)mm
Board size?/font> min.?5mm～max.510(W)mm×610(L)mm
Board thickness?0.05?.0mm
Temperature?/font>Room temp.?80℃（set
up 1?unit?br>
Vacuum?/font>Less than 1hpa（Reduced
time within 15sec ?br>
Forming pressure?/font>1Mpa（set
up 0.1Mpa unit?br>
（max. 30ton/510mm×610mm?br>
Carriage mechanism?/font>Carrier
film which put boards is
reeled with two rolls of the exit.
（Automatic reeling?br>
Carriage speed?/font>1m/min?8m/min
Variable speed（soft start?br>
Cooling?/font>Radiate heat stage
100℃→Normal temperature
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