FEATURES
◎EFFECTIVE IN HIGH/MULTIPLE LAYER CIRCUIT BOARDS LIKE BUILT UP BOARD
The method that boards pass between heated rolls copes with the board (e.g. thin board, package board) which can not be corrected with the usual heat surface plate form, too.
◎FULL AUTOMATIC OPERATION
Boards are fed to next zone automatically with wire. Together with a loader and an unloader, unmanned operation is fully performed.
◎INDIVIDUAL TEMPERATURE SETTING
Every heating/cooling plate temperature can be set and adjust individually.
Recommended temperature Heater：80℃～200℃　　Cooler：25℃（Constant temperature）
◎AUTOMATIC MEANDER CORRECT SYSTEM


SPECIFICATIONS
Applicable board： min. □70mm～max. 250(W)mm×300(L)mm
Board thickness： 0.2～2.0mm
Pass line：900±30mm
Tact time：min. 5sec＋press time
Air pressure：0.5MPa、30L/min minimum（ANR）（case of 15sec tact）
Water quantity：max. 10L
Power：3 phases、200V、50/60Hz(12KVA)